In recent years, AMD’s Ryzen processors have introduced many technical innovations, as well as updated Zen architectures. The company has abandoned the 14nm and 12nm Globalfoundry technologies to use the 7nm TSMC with the current Ryzen 5000. With the previous generation of Ryzen processors, the transition to PCI Express 4.0 was also introduced.
On the other hand, the use of DDR4 and the integrated graphics part has continued without major changes over the course of the Ryzen generations. In the latter case, it concerns the ancient Vega architecture with up to 8 compute units. Now, Twitter profile Patrick Schur presents Ryzen processor specs which means, among other things, news on these fronts.
These are leaked specifications for the Ryzen model with an “embedded” stamp, indicating that the variant is targeted at manufacturers who, for example, produce embedded PCs, thin client devices, or products for other specific applications. In the center of the processor, which has a V3000 extension, a maximum of 8 cores and 16 wires according to the Zen 3 architecture can be seen – they are made on a shrunken 6nm scale.
In addition, it is listed that the computation units in the integrated graphics segment are up to 12 and this is with the RDNA 2 graphics architecture, which is used in the Radeon RX 6000 series. On the memory front, a DDR5 input can be seen, which according to memory manufacturers is ready for this consumer Autumn when Intel launches the “Alder Lake” series. Another new feature is USB 4.0, which includes the Thunderbolt 3 protocol and transfer speeds of up to 40 Gbps.
The specs are in line with rumors surrounding the Ryzen 6000 series, which is said to be codenamed “Rembrandt” and targeted at laptops. The launch is expected to take place at the end of 2021 or sometime in 2022, but leaked and identified information indicates that the news may appear in completed systems in the not too distant future. It is also suggested that “Rembrandt” get USB 4.0 support.
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